High Conductivity Electrical Copper Foil: A Complete Guide

1. Introduction: The core position of high conductivity copper foil in electrical engineering

High Conductivity Electrical Copper Foil is a key basic material for core electrical equipment such as transformers, inductors, shielding structures, grounding busbars, new energy vehicle motors, and printed circuit boards. Compared with ordinary industrial copper foil, the core differences of high conductivity copper foil are reflected in the four dimensions of purity (IACS ≥ 100%), grain structure, surface roughness, and thickness accuracy.

Engineering measurement data shows that under the same cross-sectional area, the resistance loss of IACS 101% high-purity copper foil is 15-18% lower than that of IACS 85% ordinary copper foil. In scenarios such as high-frequency transformers (50 kHz – 1 MHz), high-power inductors, and new energy vehicle drive motors, this gap directly translates into significant differences in efficiency, temperature rise, and lifespan.

This guide systematically explains the engineering application methods of high conductivity electrical copper foil from five dimensions: conductive performance mechanism, relationship between purity and conductivity, manufacturing process differences, standards and specifications, and application selection. It covers differentiated selection strategies for two types of electrolytic copper foil (ED) and rolled copper foil (RA) in transformer windings, shielding layers, grounding busbars, PCB current collectors and other scenarios.

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2. Core mechanism of copper foil conductivity

2.1 Physical basis of electrical conductivity

The conductivity of copper is affected by the following microscopic factors:

Electron mean free path: The electron mean free path of copper is about 40 nm at room temperature; grain boundaries, impurities, and defects will shorten the mean free path.
Lattice vibration (phonon scattering): When the temperature increases, the phonon density increases and the resistivity increases; the temperature coefficient is about 0.00393 /°C (20°C)
Impurity Scattering: The effects of different impurity elements on resistivity are significantly different; elements such as P, Fe, Si, As, etc. significantly deteriorate the conductivity, while elements such as Ag, O, S, etc. have less impact
Grain boundary scattering: The finer the grains, the higher the density of the grain boundaries, and the more serious the electron scattering; coarse columnar crystals are beneficial to electrical conductivity
Stress Scattering: Internal stress causes lattice distortion and increases scattering; the conductivity of the annealed state (< recrystallization temperature) is better than that of the hard state

2.2 Definition of IACS standards

IACS (International Annealed Copper Standard) is the international annealed copper standard, which defines the conductivity of pure copper in the annealed state (20°C) as 100% IACS, corresponding to the resistivity 1.7241 × 10⁻⁸ Ω·m.

grade	IACS	Resistivity (Ω·m, 20°C)	Typical applications
Ultra High Purity Copper	101-103%	1.673-1.706 × 10⁻⁸	High frequency transformers, precision windings
High purity copper	100-101%	1.706-1.724 × 10⁻⁸	Power transformers, high power inductors
Standard Pure Copper	98-100%	1.724-1.759 × 10⁻⁸	general electrical equipment
Industrial pure copper	85-98%	1.759-2.028 × 10⁻⁸	Ordinary copper foil, shielding

2.3 Key factors affecting conductivity

In engineering, the actual conductivity of copper foil is affected by the following factors:

Chemical composition (copper purity): ≥ 99.95% is high purity; ≥ 99.99% is ultra-high purity; for every 0.01% increase in purity, the resistivity decreases by about 0.5-1%
Type and content of impurity elements:

P (phosphorus): seriously affects the conductivity, > 0.001% means significant deterioration
Fe (iron):> 0.005% affects conductivity
Si (silicon):> 0.005% Significant deterioration
S(Sulfur):> 0.0025% slight impact
O(oxygen):> 0.04% slight impact

Grain size and orientation:

Large grains (> 100 μm): excellent conductivity
Small grains (< 10 μm): poor conductivity
Rolled copper foil (RA): typical coarse columnar crystals, with the best electrical conductivity along the rolling direction
Electrolytic copper foil (ED): typical fine equiaxed crystals, conductivity slightly lower than RA

Residual Stress:

Hard state (not annealed): The conductivity is lower, 2-5% lower than the annealed state
Annealed state (soft state): highest conductivity, reaching IACS 101% level

Surface treatment layer:

Bare copper foil: highest conductivity
Tin/silver plating: increased surface resistance, but improved corrosion resistance
Coating treatment: Increases dielectric constant, may reduce high frequency performance

2.4 Effect of temperature on conductivity

Temperature (°C)	Resistivity (Ω·m)	IACS relative value
20	1.7241 × 10⁻⁸	100.0%
50	1.987 × 10⁻⁸	86.8%
100	2.300 × 10⁻⁸	75.0%
150	2.605 × 10⁻⁸	66.2%
200	2.900 × 10⁻⁸	59.5%

Engineering Conclusion: For copper foils (transformer windings, hot zone interconnections) operating above 100°C for a long time, the actual IACS value drops to about 75%, and temperature rise compensation needs to be considered during design.

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3. Manufacturing process and conductivity of copper foil

3.1 Electrodeposited Copper Foil (ED, Electrodeposited Copper Foil)

Manufacturing process: In the copper sulfate electrolyte, continuous electrodeposition is performed through the cathode roller to generate copper foil, which is washed with water, treated with anti-oxidation, and rolled up.

Features:

Thickness range: 9-105 μm (mainstream 12-70 μm)
Typical width: ≤ 1295 mm (can be expanded to 1500 mm)
Crystal Structure: Fine equiaxed crystals (< 5 μm)
Surface topography: Shiny Side + Matte Side
Typical IACS: 98-101% (depending on purity and annealing status)
ductility: good (after annealing)
Surface roughness: rough surface Ra 0.5-2.0 μm; smooth surface Ra 0.05-0.30 μm
Matter side adhesion: Excellent (suitable for lamination with insulating materials)
Cost: Lower

Typical applications: PCB manufacturing, lithium battery current collectors, transformer windings, shielding layers, ground bus bars

3.2 Rolled Annealed Copper Foil (RA, Rolled Annealed Copper Foil)

Manufacturing process: The electrolytic copper plate is rolled to the target thickness through multiple processes of hot rolling, warm rolling, and cold rolling, and then undergoes intermediate annealing and final annealing (complete recrystallization).

Features:

Thickness range: 6-100 μm (mainstream 12-50 μm)
Typical width: ≤ 600 mm (can be expanded to 1000 mm)
Crystal Structure: Coarse columnar crystals, highly oriented along the rolling direction (grains 50-200 μm)
Typical IACS:100-103% (better than ED)
Ductility: Excellent (fully annealed elongation > 35%)
Surface roughness: double-sided smooth Ra 0.05-0.30 μm
Bending resistance: Excellent (suitable for precision winding)
Cost: Higher (1.5-2.5 times that of ED)

Typical applications: high-frequency transformer windings, precision inductors, flexible circuits, new energy vehicle drive motor windings, 5G communications

3.3 Comparison of conductivity between ED and RA

index	ED copper foil	RA copper foil	difference
Typical IACS (annealed state)	99-101%	100-103%	RA excellent 1-2%
IACS (hard state)	96-98%	97-99%	near
Conductivity Anisotropy	nearly isotropic	Significant anisotropy	RA is excellent along the rolling direction
High Frequency Performance (> 100 kHz)	medium	Excellent	RA has significant advantages
Bending Resistance	medium	Excellent	RA Excellent
cost	Low	high	ED Advantages

Engineering conclusion: RA rolled copper foil is preferred in high-frequency, high-power, and precision winding scenarios; ED electrolytic copper foil is preferred in PCB, lithium battery current collector, and general shielding scenarios.

3.4 Effect of annealing process on electrical conductivity

Annealing is a key process to improve the conductivity of copper foil. The main annealing parameters are:

Annealing temperature: 300-650°C (complete recrystallization)
Annealing time: 0.5-4 hours (depending on thickness)
Atmosphere: Nitrogen (N₂), hydrogen-nitrogen mixture (H₂/N₂) to prevent oxidation
Cooling method: Furnace cooling or controlled cooling

Effect of annealing on conductivity:

state	IACS	Hardness(HV)	Elongation
Hard state (rolled state)	96-98%	100-130	< 5%
Semi-hard state (partially annealed)	98-100%	60-100	5-20%
Soft state (fully annealed)	100-103%	40-60	30-50%

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4. Key performance indicators of high conductivity copper foil

4.1 Electrical performance

Volume resistivity: 1.673-1.724 × 10⁻⁸ Ω·m (20°C, annealed)
Mass resistivity: 0.153-0.158 Ω·g/m² (resistance per unit area, depends on thickness)
IACS:100-103% (high purity annealed state)
High frequency conductivity (> 100 kHz): Considering the skin effect, the effective conductivity decreases; RA is better than ED
Dielectric constant (coated copper foil): 3.0-4.5
Dielectric loss tangent: 0.005-0.025 (depends on coating)

4.2 Mechanical properties

Tensile strength: 200-450 MPa (depends on the state: high in hard state, low in soft state)
Elongation: 1-50% (low in hard state, high in fully annealed state)
Hardness HV:40-130 (fully annealed to hard)
Bending performance: RA is better than ED (RA can withstand 0T bending, ED usually ≥ 3T)
Yield Strength:70-380 MPa

4.3 Thickness and tolerances

Nominal thickness (μm)	Typical tolerances	thickness uniformity
9-12	±5%	extremely high
18-35	±4%	high
50-70	±3%	high
100+	±3%	medium

4.4 Surface properties

Surface roughness Ra:0.05-2.0 μm (depending on type and surface condition)
Surface cleanliness: No oxidation, no oil, no foreign matter
Anti-oxidation treatment: Passivation coating, organic coating, electroplated tin/silver

4.5 Thermal performance

Long-term use temperature: 150-200°C (depending on the insulating coating)
Short term overload temperature: up to 250°C (short term)
Thermal conductivity: 385-401 W/(m·K) (pure copper)
Thermal expansion coefficient:16.5-17.0 × 10⁻⁶ /°C (20-300°C)
Specific heat capacity:0.385 J/(g·K)

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5. Relevant standards and specifications

5.1 International standards

IPC-4562: Metal Foil for Printed Wiring Board Applications (metal foil for printed circuit boards)
IPC-4563: Metal Foil for High-Frequency/Microwave Applications (Metal Foil for High-Frequency/Microwave Applications)
ASTM B152: Standard Specification for Copper Sheet, Strip, Plate, and Rolled Bar (copper sheet, strip, rod standard)
ASTM B370: Standard Specification for Copper Sheet and Strip for Building Construction (copper sheet for construction)
ASTM B846: Standard Terminology for Copper and Copper Alloys (copper and copper alloy terminology)
IEC 60246: Specification for Copper Clad Laminates (copper clad laminates)
IEC 60194: Printed Board Design, Manufacture and Assembly – Terms and Definitions (printed board terms)
UL 94: Standard for Flammability of Plastic Materials (material flame retardant grade)

5.2 National standards

GB/T 5230: Electrodeposited Copper Foil
GB/T 5231: Processed copper and copper alloy grades and chemical compositions
GB/T 11091: Copper and copper alloy plates and strips
GB/T 18813: Transformer Copper Strip
GB/T 5584.1-4: Copper, aluminum and their alloy flat wires and strips for electrical purposes
GB/T 5121: Chemical analysis methods for copper and copper alloys
GB/T 2059: Copper and copper alloy strips

5.3 Industry standards

SJ/T 11438: Copper foil for printed boards
YS/T 1037: High purity copper foil
YS/T 632: Copper foil for batteries
DL/T 503: Technical conditions for copper strips used in power transformers
T/CPCA 4002: High performance copper foil for printed circuits

5.4 Performance comparison standards

standard	Scope of application	Conductivity requirements
ASTM B152	Industrial pure copper	IACS ≥ 95%
GB/T 18813	Transformer copper strip	IACS ≥ 97% (common)/ ≥ 100% (high purity)
IPC-4562 Type 3	Standard electrolytic copper foil	IACS ≥ 98%
IPC-4562 Type 5	High performance electrolytic copper foil	IACS ≥ 100%
IPC-4562 Type 7	Ultra high performance copper foil	IACS ≥ 101%

Engineering conclusion: The IACS level must be clearly defined when purchasing high conductivity copper foil. IACS ≥ 100% is usually required to meet the definition of “high conductivity”.

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6. Application scenarios of high conductivity copper foil

6.1 High frequency transformer winding

Frequency range:50 kHz – 1 MHz
Application products: switching power supply (SMPS), high frequency inverter, induction heating, inductance heating
Copper foil type: RA rolled copper foil (preferred); ED annealed copper foil (optional)
Thickness Selection:0.035-0.105 mm(35-105 μm)
Key Performance Requirements:
High conductivity (IACS ≥ 101%)
Bending resistance (0T bending without cracking)
Surface finish (Ra < 0.30 μm)
Thickness uniformity (±3%)
Typical specifications: width 100-500 mm; roll diameter 300-500 mm

6.2 High power power transformer

Application products: 110 kV / 220 kV / 500 kV main transformer, rectifier transformer, electric furnace transformer
Copper foil type: ED annealed copper foil (mainstream); copper strip (alternative)
Thickness selection: 0.20-1.50 mm (200-1500 μm)
Key Performance Requirements:
High conductivity (IACS ≥ 100%)
Short circuit resistance (high yield strength ≥ 200 MPa)
Insulation layer adhesion
Long-term heat resistance (155-220°C)
Typical structure: copper foil wrapping + insulating paper (kraft paper/Nomex)
Advantages: 15-25% higher space utilization than enameled round wire

6.3 New energy vehicle drive motor

Application products: Permanent magnet synchronous motor (PMSM), asynchronous motor, flat wire motor
Copper foil type: RA rolled copper foil (mainstream); rectangular enameled copper wire (comparison)
Thickness selection: 0.20-0.50 mm (200-500 μm)
Key Performance Requirements:
High conductivity (IACS ≥ 100%)
High frequency winding adaptation (reduce skin effect losses)
Vibration resistance (> 30 g vibration)
High temperature resistance (180°C+)
Advantages: The full rate is 20-30% higher than that of round wire ducts; the cost is 30-40% lower than that of flat wires

6.4 Printed circuit board (PCB)

Application products: Rigid PCB, flexible PCB, rigid-flex board
Copper foil type: ED electrolytic copper foil (mainstream); RA rolled copper foil (high frequency/high speed scenario)
Thickness Selection:9-105 μm(0.5-3 oz)
Key Performance Requirements:
Surface roughness (low roughness facilitates high-speed signal transmission)
Peel strength (> 1.0 N/mm)
Thermal stability (> 280°C non-foaming)
Dimensional stability (CTE matched substrate)
Application layer: signal layer, power layer, ground layer

6.5 Lithium battery current collector

Application products: power batteries, energy storage batteries, consumer batteries
Copper foil type: ED electrolytic copper foil (mainstream)
Thickness selection: 6-12 μm (ultra-thin), 12-20 μm (mainstream)
Key Performance Requirements:
High tensile strength (> 350 MPa)
High elongation (> 5%)
Thickness uniformity (±3%)
Surface finish (even coating of active material)
New direction: Composite copper foil (copper-plastic-copper three-layer structure)

6.6 Shielding and Grounding

Application products: Electromagnetic shielding (EMI), electrostatic shielding, grounding busbar, shielded room
Copper foil type: ED copper foil (mainstream); RA copper foil (high flexibility scenario)
Thickness Selection:0.035-0.105 mm
Key Performance Requirements:
High conductivity (high frequency shielding efficiency)
Anti-corrosion (anti-oxidation coating)
Easy to process (can be punched and cut)
Flame retardancy (UL 94 V-0)
Application: Transformer magnetic shielding, motor shielding, cable shielding, computer room shielding wall

6.7 Busbar and electrical connections

Application products: Distribution cabinet busbars, transformer lead wires, switching equipment
Copper foil type: ED annealed copper foil (mainstream); copper strip (alternative)
Thickness Selection:0.30-2.00 mm
Key Performance Requirements:
High conductivity (IACS ≥ 100%)
High mechanical strength (resistance to short-circuit electric force)
Surface treatment (tin plating/silver plating corrosion resistance)
Good conductive contact

Engineering conclusion: Different application scenarios have significantly different requirements for the conductivity, mechanical, and surface properties of copper foil, and the selection must be customized according to the application characteristics.

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7. Selection decision of high conductivity copper foil

7.1 Selection parameter list

parameter	Options	Key considerations
Copper Foil Type	ED / RA / Compound	Frequency, winding accuracy, cost
Purity Level	IACS 95-103%	Conductivity requirements, cost
thickness	9-2000 μm	Carrying capacity, mechanical strength
width	100-1500 mm	Equipment specifications
state	Hard/Semi-hard/Soft	Mechanical properties, formability
Surface treatment	Bare copper / tin plated / silver plated / coated	Anti-oxidation, welding, bonding
INSULATION PACKAGE	Kraft paper / Nomex / lacquered film	Insulation level

7.2 Selection decision-making process

Application requirements → Frequency → Ampacity → Mechanical strength → Conductivity → Copper foil type → Thickness → Surface treatment → Verification testing ↓ Standard compliance verification ↓ Supplier evaluation ↓ Specification confirmation

7.3 Comparison of selections for different applications

Application scenarios	Recommended copper foil	thickness	state	surface treatment	Remark
High Frequency Transformer	RA	35-105 μm	soft state	bare copper/coated	Prioritized conductivity
Power Transformer	ED annealing	0.2-1.5 mm	soft state	Insulating paper bag	Excellent space utilization
Drive Motor	RA	0.2-0.5mm	soft state	Paint film composite	High slot fill rate
PCB High Frequency Layer	RA	12-35 μm	soft state	low roughness	high speed signal
PCB standard layer	ED	12-70 μm	semi-hard	Standard coarsening	Cost-effectiveness
Lithium battery current collector	ED ultra-thin	6-12 μm	hard state	surface coating	High strength
Shield Ground	ED	35-105 μm	semi-hard	Tin plating/anti-oxidation	cost control

7.4 Project examples

Example 1: 100 kHz high power high frequency transformer

Application: Industrial induction heating power supply, 500 kW
Selection: RA rolled copper foil, thickness 0.070 mm, width 200 mm, IACS 102%, fully annealed
Advantages: Skin depth 0.21 mm, matching copper foil thickness; high conductivity, efficiency increased by 1.5%
Verification: IEC 62368, UL 60950, RoHS

Example 2: 220 kV main transformer winding

Application: Power transformer 240 MVA
Selection: ED annealed copper foil, thickness 0.50 mm, width 800 mm, IACS 100%, soft state
Advantages: Excellent insulation coordination, 20% high space utilization, strong short circuit resistance
Verification: GB/T 1094, IEC 60076, IEEE C57.12.00

Example 3: New energy vehicle flat wire motor

Application: EV drive motor, peak power 200 kW
Selection: RA rolled copper foil, thickness 0.30 mm, width 8 mm, IACS 101%, soft, paint film composite
Advantages: slot full rate 75% (round wire 60%); high conductivity, peak efficiency 97.5%
Verification: GB/T 18488, IEC 60349, QC/T 1068

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8. Inspection and acceptance of copper foil

8.1 Key testing items

Conductivity (IACS): Eddy current conductivity meter; ASTM E1004, GB/T 32791
Resistivity: four-terminal method; GB/T 3048.2
Thickness: Precision thickness gauge (accuracy ±1 μm); ASTM E252
Width: Vernier caliper or projector
Surface roughness: stylus roughness meter; ISO 4287
Tensile strength/elongation: Universal material testing machine; ASTM E8, GB/T 228
Hardness: Vickers hardness tester; ASTM E92
Chemical composition: Direct reading spectrometer (OES) or ICP-MS; GB/T 5121
Surface cleanliness: contact angle test; visual inspection + magnifying glass
Antioxidation: Damp heat test (85°C/85% RH, 1000h)

8.2 Sampling inspection ratio

Purchase quantity	Sampling inspection ratio
< 100kg	100%
100-1000kg	5-10%
1000-10000kg	1-3%
> 10000 kg	0.5-1%

8.3 Key Performance Acceptance Criteria

performance	Acceptance criteria	Test method
IACS	≥ 100% (high conductivity grade)	ASTM E1004
Thickness Tolerance	±3-5%	Precision thickness gauge
tensile strength	200-450 MPa (depending on the state)	ASTM E8
Elongation	≥ 5%(hard state)/ ≥ 30%(soft state)	ASTM E8
Surface Ra	0.05-0.30 μm (glossy surface)	ISO 4287
purity	Cu ≥ 99.95% (high purity)	OES/ICP-MS
Phosphorus content	≤ 0.001% (high purity copper)	ICP-MS

8.4 Third-party testing agency

Domestic: China Electric Power Research Institute, Xi’an High Voltage Electrical Apparatus Research Institute, Beijing Nonferrous Metals Research Institute, Shanghai Cable Research Institute, SGS China
International: KEMA (Netherlands), CESI (Italy), TÜV (Germany), UL (USA), SGS (Switzerland), Bureau Veritas (France)
Selection criteria: CNAS/CMA certification, industry recognition, testing capabilities, report authority

Project Conclusion: The copper foil acceptance must have measured conductivity (IACS) and cannot rely solely on the supplier’s certificate; high conductivity grades (≥ 100% IACS) must have a third-party retest.

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9. Common Misunderstandings and Avoidance

9.1 Misunderstanding 1: Only look at purity without looking at grain structure

Error: Thinking that a copper content of 99.99% must be a high conductivity copper foil Example: A certain 99.99% purity electrolytic copper foil has an IACS of only 98% due to its fine grain size Avoidance: Comprehensive purity + grain structure + annealing state + residual stress judgment

9.2 Misunderstanding 2: Confusing the applicable scenarios of ED and RA

Error: High-frequency transformers use ED electrolytic copper foil Example: 100 kHz transformers use ED copper foil, which has high skin effect loss and an efficiency of only 92% Avoidance: Prioritize RA rolled copper foil in high-frequency scenarios; clarify the relationship between frequency and thickness

9.3 Misunderstanding 3: Ignoring the influence of surface roughness

Error: Choose high-roughness copper foil for high-speed signal PCB Example: 5G base station PCB uses roughness Ra 2.0 μm copper foil, which increases signal loss by 30% Avoidance: High-speed/high-frequency PCB must use low-roughness copper foil (Ra < 0.30 μm)

9.4 Misunderstanding 4: Lack of temperature compensation

Error: The conductivity measured at room temperature is used directly for high temperature design Example: Copper foil with 100% IACS at room temperature has an actual IACS of only 85% at 120°C Avoidance: Temperature coefficient compensation must be considered for high temperature applications; leave a 15-25% conductivity margin

9.5 Misunderstanding 5: Excessive trust in supplier qualifications

Error: Completely rely on supplier certificates, no on-site retesting Example: A certain batch of copper foil marked 102% IACS, actual measurement 95% Avoidance: Key projects must be retested by a third party; establish a list of qualified suppliers

Engineering conclusion: The selection and acceptance of high conductivity copper foil must be comprehensively judged from multiple dimensions including purity, grain structure, annealing state, surface morphology, and temperature coefficient.

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10. Storage, operation and maintenance of copper foil

10.1 Storage environment

project	Require	Things to note
temperature	10-30°C	Avoid direct sunlight and heat sources
humidity	Relative humidity 30-65%	Moisture-proof packaging or dehumidification
Cleanliness	Dust-free and corrosive gas-free	Keep away from acid, alkali and salt spray
Stacking	Stand up (spool) or lay flat (sheet)	Avoid extrusion and deformation
Storage Period	Within 12 months	Exceeding the limit requires re-testing

10.2 On-site operating specifications

Inspection before unpacking: packaging integrity, batch number, appearance
Cutting: Use a special shearing machine to avoid burrs
Bending: Bend along the rolling direction (RA), bending radius ≥ 1T
Soldering: Lead-free soldering, temperature 280-320°C, time < 5 seconds
Surface Cleaning: Absolute ethanol or isopropyl alcohol; avoid chlorine-containing solvents
Insulation wrapping: Synchronous tension control to avoid copper foil deformation

10.3 Maintenance points

Appearance inspection: Check the oxidation of the stored copper foil monthly
Performance retest: Copper foil stored for more than 6 months needs to be retested for conductivity.
Usage order: first in, first out (FIFO)
Failure treatment: Severely oxidized and discolored copper foil needs to be evaluated and processed

Engineering Conclusion: Copper foil storage and handling specifications are key to maintaining high conductivity performance. Oxidation and mechanical damage will significantly reduce performance.

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11. Supplier contact and suggestions

For the selection and procurement of high conductivity electrical copper foil, recommended suppliers:

Company information

Company:Zhengzhou LP Industry Co., Ltd.
Expertise: Magnet wire, copper foil, copper strip, copper stranded wire, composite insulation materials
Service Scope: Project-level technical support, specification customization, batch supply

product specifications

Copper foil type: ED electrolytic copper foil + RA rolled copper foil, full coverage
Thickness range:0.006-2.0 mm (6 μm – 2 mm)
Width range: ≤ 1500 mm (can be customized)
Purity grade: IACS 100-103% (full range of high conductivity)
Surface treatment: bare copper / tin plated / silver plated / coated / passivated

Contact information

Email:office@lpwindingwire.com
WhatsApp:0086-19337889070
Response speed: technical response within 24 hours, global supply

With 30 years of experience in exporting electromagnetic wires and engineering project supply cases in more than 50 countries around the world, it can provide complete technical solutions and supply chain guarantees for high conductivity electrical copper foil applications.

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Appendix: Reference standards and literature

international standards

IPC-4562:Metal Foil for Printed Wiring Board Applications
IPC-4563:Metal Foil for High-Frequency/Microwave Applications
ASTM B152:Standard Specification for Copper Sheet, Strip, Plate, and Rolled Bar
ASTM B370:Standard Specification for Copper Sheet and Strip for Building Construction
IEC 60246:Specification for Copper Clad Laminates
IEC 60194:Printed Board Design, Manufacture and Assembly – Terms and Definitions
UL 94:Standard for Flammability of Plastic Materials

National standards

GB/T 5230: Electrolytic copper foil
GB/T 5231: Processed copper and copper alloy grades and chemical compositions
GB/T 18813: Transformer copper strip
GB/T 5584.1-4: Copper, aluminum and their alloy flat wires and strips for electrical purposes
GB/T 11091: Copper and copper alloy plates and strips
GB/T 2059: Copper and copper alloy strips
GB/T 5121: Chemical analysis methods for copper and copper alloys
YS/T 632: Copper foil for batteries
YS/T 1037: High purity copper foil

industry standard

SJ/T 11438: Copper foil for printed boards
DL/T 503: Technical conditions for copper strips used in power transformers
T/CPCA 4002: High performance copper foil for printed circuits